1. Use of infrared welding technology which is developed independently. 2. Use of an infrared heat lamp. Heat is easy to pierce and distribute evenly, which overcomes disadvantage (burn out elements) of traditional welding machines. 3. Easy operation. You just need one-day training and you can operate it skillfully. 4. No need for unsolder tools. This machine can unsolder all components between 35 -50 mm. 5. This machine has 800W hot-melt system. Its preheating area is 240 x 180 mm. 6. Infrared heating without heated air flowing. No impact on circumjacent small elements. It is suitable for all of the elements, especially Micro BGA components. 7. The T-870A is suitable for a variety of computers, notebooks and the rework or repair of their BGA components, especially in a Northbridge /Southbridge chipset computer architecture.